01 / SAPPHIRE
Sapphire
Sapphire ingots, substrates, polished wafers and 310 × 310 mm sheets for LED substrates and optical windows.
Purity> 5N
Thickness700 / 1,000 μm
Tolerance±3 μm
Sapphire · Silicon carbide · Yantai, China
Precision Slicing of Semiconductor Materials — Reliable Substrates for Advanced Manufacturing.
Yantai Likai Semiconductor Technology Co., Ltd. specializes in precision slicing and wafer processing of semiconductor materials, including sapphire, silicon carbide, monocrystalline silicon, fused quartz and alumina ceramics. With fully in-house capabilities spanning crystal growth, slicing, lapping, polishing and inspection, every piece is inspected before shipment, delivering high-precision, high-reliability substrates and wafers to customers worldwide.
Product range
All specifications
Five material systems, one fully integrated in-house line
The portfolio covers five major material families: sapphire, silicon carbide, monocrystalline silicon, fused quartz and alumina ceramics. From crystal growth, precision slicing, lapping and polishing to inspection and packaging, every step is performed in the same facility, enabling closed-loop quality control from material to finished product.
01 / SAPPHIRE
02 / SILICON CARBIDE
Silicon carbide
SiC substrates in 6 and 8 inch: n-type for power devices, semi-insulating for RF and HEMT.
Diameter6 in / 8 in
Thickness350 / 500 μm
GradeN-type · semi-insulating
03 / SILICON
Monocrystalline silicon
Prime and test-grade silicon wafers for device development, carrier plates and process trials.
Diameter6 in / 8 in / 12 in
Thickness200–1,000 μm
Orientation<100> · <111>
04 / FUSED QUARTZ
Fused quartz
JGS1 / JGS2 / JGS3 fused quartz slides, windows and discs where transmission matters most.
GradeJGS1 / JGS2 / JGS3
Thickness0.5–20 mm
Tolerance±0.05 mm
05 / ALUMINA CERAMIC
Alumina ceramics
95 % and 99 % alumina substrates and wear parts, sliced and lapped to the thickness on your drawing.
Purity95 % / 99 %
Thickness0.25–10 mm
Flatness≤ 0.02 mm
Custom slicing
Beyond standard products, the company accepts custom slicing of GaAs, GaN, glass, piezoelectric ceramics and non-standard geometries. Provide drawings and target tolerances for evaluation; new materials can be validated by sample slicing before mass production.
Send a drawing
Nine controlled steps from crystal to finished wafer
Quality control
Nine tightly controlled steps, piece by piece
Powered by core processes such as diamond-wire multi-wire sawing, every wafer goes through nine controlled steps: crystal growth, cropping, OD grinding, crystal orientation inspection, multi-wire slicing, edge chamfering, double-side lapping, chemical mechanical polishing (CMP), and inspection & packaging. Critical parameters are recorded batch by batch and archived by lot number, ensuring consistent thickness, TTV, flatness and surface quality — stable, reliable and fully traceable.
01
Crystal Growth
Sapphire is grown by the Kyropoulos (KY) method, silicon carbide by physical vapor transport (PVT), and monocrystalline silicon by Czochralski (CZ) pulling. Intrinsic crystal quality — dislocation density and lattice integrity — is established at this stage. This process line covers sapphire, SiC and monocrystalline silicon ingots.
02
Cropping
Seed ends, shouldering sections and tails are cropped off the ingot; the straight, usable portion is cut to length, lot-numbered and warehoused, ensuring full batch traceability.
03
OD Grinding
The ingot is ground to nominal outer diameter, with the orientational flat or notch machined in the same setup — ensuring concentricity between the OD and the locating reference for slicing.
04
Crystal Orientation Inspection
X-ray diffraction determines the crystal plane orientation (C-plane for sapphire and SiC; <100> / <111> for monocrystalline silicon) and the off-angle; only qualified ingots proceed to slicing. <100> / <111> for monocrystalline silicon) and the off-angle; only qualified ingots proceed to slicing.
05
Multi-wire Slicing
A single diamond wire cuts the whole ingot into thin wafers in one pass. Kerf loss is set by wire diameter, while subsurface damage and bow are governed by wire tension, feed rate and cooling.
06
Edge Chamfering
Wafer edges are rounded to eliminate micro-cracks and prevent chipping during subsequent processing and handling; edge profile is held within drawing tolerances.
07
Double-side Lapping
Free-abrasive double-side lapping removes the saw-damaged subsurface layer, corrects bow and warp, and brings thickness and TTV to target — leaving a uniform stock allowance for polishing.
08
Chemical Mechanical Polishing (CMP)
Double-side CMP delivers nano-scale surface roughness and a damage-free surface. Final thickness is already locked in at the lapping stage; this step focuses on surface quality.
09
Inspection & Packaging
Every wafer is 100% inspected for thickness, TTV, bow/warp, parallelism and surface roughness (transmittance added for optical materials), with data archived by batch number, then layer-packed in a cleanroom.
Tolerances
Precise crystallographic orientation; every piece inspected before shipment
Crystallographic orientation is verified by X-ray diffraction before slicing to eliminate orientation errors. Finished products are inspected piece by piece for thickness, TTV, flatness, roughness and transmittance, with data archived by batch number. Wafers are double-layer packaged under controlled clean-room conditions, with a certificate of conformance and inspection report enclosed.
±0.2 mm
Dimension tolerance, 310 × 310 sheet
±3 μm
Thickness tolerance, 700 / 1,000 μm
<0.3 μm
Ra surface roughness after polish
0 %
Pieces inspected before shipment
Orientation by X-ray
C-axis offcut and reference flat are verified on every ingot before slicing.
Measured, then packed
Thickness, TTV, flatness, roughness and transmission are recorded against the batch number.
Cleanroom packing
Double-bagged in a controlled area, with a certificate of conformance in the box.
Applications
All applications
Broad applications across mainstream semiconductor sectors
Our products serve LED & optoelectronics, power electronics, consumer electronics & wearables, and optics & ceramics, providing downstream customers with stable, reliable substrates and wafers.
LED & optoelectronics
Patterned sapphire substrates and C-plane wafers.
PSS substratesC-plane2–6 in
Power electronics
SiC substrates for MOSFETs and Schottky diodes.
6 in / 8 inN-typeSemi-insulating / HEMT
Consumer & wearable
Sapphire covers for watch crystals, camera lenses and fingerprint sensors.
CoversWindowsThinned
Optics & ceramics
Quartz windows and alumina ceramic parts for instruments.
JGS gradesAluminaCustom
About LiKai
Yantai Likai Semiconductor Technology Co., Ltd.
Yantai Likai Semiconductor Technology Co., Ltd. ("Likai Semiconductor") — a wholly owned subsidiary of Yantai Likai CNC Technology Co., Ltd. ("Likai Technology") — specializes in precision slicing of sapphire, silicon carbide, monocrystalline silicon, quartz glass and alumina ceramics.
With a complete in-house line from crystal growth to inspection, it combines diamond-wire multi-wire cutting with X-ray crystal-orientation inspection to achieve sapphire thickness tolerance ±3 μm and Ra ≤ 0.3 μm, inspecting every piece and archiving data by batch. Its substrates and wafers serve LED and optoelectronics, power electronics, consumer electronics, optics and ceramics worldwide.
Yantai Likai Numerical Control Technology Co., Ltd.
Yantai Likai Numerical Control Technology Co., Ltd. ("Likai Technology"), established in June 2018, is a high-tech enterprise covering the entire cutting technology chain — equipment, diamond wire and multi-wire cutting services — and a national "Little Giant" enterprise, a "Double Soft" certified enterprise and an intellectual property application pilot enterprise recognized by China's Ministry of Industry and Information Technology.
Certified to ISO 9001, ISO 14001, ISO 45001, GB/T 29490, EU CE and UL, it supplies multi-wire cutting, laser cutting and chamfering equipment for metal, sapphire, semiconductor and other advanced hard and brittle materials, exporting to more than ten countries and providing full support in equipment, processes and R&D for Likai Semiconductor.
Facilities
A fully integrated in-house line, from crystal growth to inspection
Crystal growth, slicing, lapping, polishing and inspection are all performed at the same facility in Yantai, ensuring efficient process flow and closed-loop quality control, with full traceability of quality records at every stage.
Send us your drawing or your target specs.
Send the material, dimensions, thickness and quantity; we reply with a feasible specification and a lead time — and say so plainly when it is out of range.